CEF Testing labs

Data acquisition and interfacing equipment for general analogue/digital characterisation and testing of chips and devices.

The lab is equipped with a host of soldering equipment. Standard soldering irons are complemented by hot-air tools, hot plates, air extraction, a stock of components, and electronic testing equipment.

The R&S ZNB40 VNA enhances the labs’ ability to develop high-speed RF PCBs and RF components. It has a frequency range up to 43.5 GHz and wide dynamic range of 140 dB.

Fast-turnaround imaging at much higher magnification than standard optical microscopy with X-Ray element analysis for composition mapping across surfaces.

The parameter analyzer is a Versatile multi-purpose electronic characterisation capability including I-V, C-V and ultra-fast pulsing.

Two 150 mm probestations with coplanar GSG RF probes suitable for high frequency characterisation of chips and  waveguides up to 40 GHz. The stations also support advanced optics for optical signal sourcing and acquisition.

Two state-of-art semi-automatic probestations (Cascade MicroTech Summit 12K and MPI TS200-IFE) support large-scale, high-precision, automated testing with accurate positioning of up to 200 mm wafers and over a temperature range of -60°C to 300°C in electrically and environmentally isolated microchambers.

The Park NX20 offers a wide range of measurement capabilities for surface analysis for up to 6” wafers. It can do standard surface roughness and 3D structure measurements while offering additional modes for in-depth analysis. These include Kelvin Probe Microscopy, Conductive AFM Microscopy and Magnetic AFM modes all in an electrically isolated environment with a temperature range between -25C and 180C.

X-Ray analysis with the Bruker D8 Discover for bulk and grazing incidence diffractometry, stress analysis and reflectometry. Equipped with a high-intensity X-ray source and both 1D and 2D detectors.

The Zeiss LSM confocal microscope is designed for imaging fluorescence of transparent or translucent samples on biological and chemically functionalised samples. It can produce image stacks for 3D visualisation and supports muti-wavelength excitation (487-594 nm).

Equipment for deposition of solution-processed materials via spin coating, as well as for depositing metals in high vacuum. The tool is also equipped with a probe station, allowing for the full manufacturing and characterisation of optoelectronics in a controlled environment.

A general wet chemistry environment for surface cleaning and modification of substrates. Services include nitrogen, CDA, ultrasonic cleaning, spin coating and hot plates.

Modular, multi-purpose probe stations can be configured for unusual samples and process depending on the demands of the user while providing all the standard I-V/C-V characterisation tooling and either coax or guarded triax connections.